High-power LED white light use and LED chip heat dissipation treatment methods |
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| Reading Volume： 【 1823 】 | Time： 【 2016-08-25 】 | |
| Nowadays LED white light products are gradually used in various fields and put into use. Everyone is feeling the amazing pleasure brought by its high-power LED white light and is also worried about its various practical questions! Mainly from the nature of high-power LED white light itself. High-power LEDs still have poor light-emitting uniformity and short lifespan when shutting down data. Especially the heat dissipation problem of its LED chips is difficult to get excellent treatment, and it cannot take advantage of the waiting use advantages of white light LEDs. Secondly, from the market price of high-power LED white light. Nowadays, high-power LED is still a kind of aristocratic white light product. Because the quotation of high-power products is still too high, and the technology still needs to be improved, high-power white light LED products are not for anyone who wants to use it. Let's break down the related questions about high-power LED heat dissipation. In recent years, with the efforts of industry experts, the following improvement plans have been proposed for the heat dissipation of high-power LED chips: 1. Increase the amount of light emitted by increasing the LED chip area. 2. Choose to package several small area LED chips. 3. Change the LED package data and fluorescent data. So can the heat dissipation of high-power LED white light products be completely improved through the above three methods? It's really amazing! First of all, although we increase the area of the LED chip to obtain more luminous flux (the number of beams passing through a unit area in a unit of time is the luminous flux, unit ml), we hope to achieve the white light effect we want, but because of the original practice The area is too large, resulting in some scenes of uprooting in the use process and structure. So is it really impossible to deal with the problem of high-power LED white light heat dissipation? Of course it is not impossible to handle it. Regarding the negative question of simply increasing the chip area, LED white light manufacturers rely on the improvement of electrode structure and flip chip structure, and use methods such as packaging several small-area LED chips to improve the surface of high-power LED chips to reach 60lm. /W high luminous flux, low heat dissipation luminous power. There was originally a way to effectively improve the heat dissipation of high-power LED chips. That is to replace plastic or plexiglass with silicone resin for its white light packaging materials. Replacing the package data can not only deal with the heat dissipation problem of the LED chip, but also improve the lifespan of the white LED. It is the best of both worlds. What I want to say is that almost all high-power white LED products like high-power LED white light should use silicone as the packaging material. Why is it necessary to use silicone as packaging materials for high-power LEDs today? Because the absorption rate of silica gel to light of the same wavelength is less than 1%. However, the absorption rate of epoxy resin for light from 400-459nm is as high as 45%. It is very simple that the aging of this short-wavelength light will cause severe light decay in the future. Of course, there will be many questions like heat dissipation of high-power LED white light chips in the practical life of growth, because the wider the use of high-power LED white light, the deeper and more difficult it will be! The LED chip is characterized by extremely high heat generation in a very small volume. The heat capacity of the LED itself is very small, so it is necessary to conduct the heat out at the fastest speed, otherwise a high junction temperature will occur. In order to draw the heat out of the chip as much as possible, many improvements have been made to the structure of the LED chip. In order to improve the heat dissipation of the LED chip itself, the main improvement is to select substrate materials with very good thermal conductivity. For example, the thermal resistance of Cree's LED is at least twice as low as other companies' thermal resistance due to the use of silicon carbide as the substrate. Even if the heat resistance from the chip to the packaged materials can be handled, if the heat dissipation from the package to the PCB board is not good, the same will also cause the temperature of the LED chip to rise, showing the phenomenon of reduced luminous power. So, just like Panasonic, in order to deal with such questions, starting in 2005, it has planned white LEDs including circular, linear, and surface shapes into one PCB substrate to overcome it. Perhaps because of the current development from packaging to PCB board Questions about the suspension of heat dissipation. |
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