Epoxy adhesive in electronic components |
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| Reading Volume： 【 268 】 | Time： 【 2023-05-09 】 | |
| When it comes to the electronics industry, the picture that comes to our mind is like this: from simple home appliances, cell phones, computers to high-speed trains and ships, mankind has entered the era of intelligence. In the future, driverless and smart home will become the focus of social development. As the market of electronic industry is getting bigger and bigger, the application field is also expanding, and epoxy adhesive plays an important role, especially in the field of electronic components is indispensable. It not only plays a protective role but also can achieve a very good sealing effect after curing, which ensures that the electronic components will not come into contact with each other and produce stress and affect the performance of the components themselves. For us, epoxy adhesive is like the "Optimus Prime" in our car, it has an irreplaceable role. Let's learn more about the fields in which epoxy resin can play an important role. 01Electronic components In electronic components, general conductive and epoxy adhesives are used for fixing, because the epoxy resin can connect the metal and insulator firmly after curing. In our common capacitors is the need to use epoxy glue for bonding and sealing. For electronic components, they are characterized by high working temperature, good insulation, dimensional stability and strong resistance to mechanical damage. So electronic components often need to use epoxy resin electronic components as a fixing agent for insulation protection! 02 Integrated Circuit Packaging Integrated circuit packaging is mainly used to install and fix the circuit composed of components and other system components, so that it becomes a whole and play the role of packaging protection. For circuit components (such as silicon wafers, silicon vias, silicon bonding) and chips (such as SMD, lead connectors, etc.) composed of components, in the semiconductor production process, often using the SMD packaging method; for electronic system components composed of circuits, which are characterized by small size and large number; therefore, in order to improve the reliability of the circuit, it needs to be sealed; for integrated circuit chips, not only to For integrated circuit chips, not only sealing but also providing excellent insulation and stability. For IC packaging, epoxy resin is one of the essential sealing materials, and we can also use it as an insulator or reinforcement in the IC packaging process. 03 Electronic device packaging With the increasing demand for high-tech products, the requirements for electronic products are getting higher and higher, therefore, more and more new high-performance semiconductor devices are manufactured. And electronic circuit as a special product, its packaging are very precise. For example, the application of epoxy adhesive between the PCB board and the pad, the middle of the connector and the middle of the printed circuit board can play a certain protective role to avoid poor contact and other problems. 04 Semiconductor component packaging Semiconductor component packaging technology (including pin, pin patch, etc.) refers to the electronic components fixed on the circuit board under certain conditions, and make it completely isolated from the surrounding environment, so as to improve the performance of the entire electronic products. Semiconductor device packaging is divided into two main categories: one is the pin package, the other is the lead solder package. These two types require different adhesives. (1) Pin package: the use of the IC IC input, intermediate contact points and other parts of the coating pin material will be connected to form a complete circuit components. (2) Lead soldering: The encapsulated IC is soldered to the external conductors and other electronic components to act as a package. Among them, it is most common to use epoxy encapsulation between chips. Of course, epoxy adhesive plays an indispensable role in our life! In daily use, we can apply it in the fields of cell phone, computer and other electronic products assembly and circuit board assembly. |
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