COB packaging glue: the new trend of COB packaging for the third-generation LED display |
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| Reading Volume： 【 1979 】 | Time： 【 2018-01-24 】 | |
| Small-pitch LEDs have been surging in the past two years, and the output has increased by nearly half year-on-year. The small pitch is developed rapidly from the Z3 and Z4 pitch full-color screens. Before users had time to adapt, they were fascinated by its performance, viewing angle, and the chromaticity of the seamless large screen. However, the number of pixels with small pitches increased sharply. The original 1/10,000 dead pixel rate seemed to be negligible in Z4. But in Z2.5, it became dazzling. A certain company installed a Z1.9 full-color screen. What users have a headache is the dead pixel rate. It needs to be maintained almost once a week, which affects the reputation of the small pitch. Is the small pitch really constrained by the defective pixel rate? There is a technology that has quickly gained popularity in the two years of the small pitch, that is, the small pitch of the COB process. The original COB process has special abilities in four aspects: stability, luminous effect, durability and power consumption. Process stability COB (Chip On Board), that is, the RGB chip is packaged on the circuit board. It is a new full-color LED technology developed based on the solid-chip planar technology and precise dispensing technology. In the COB product process, the PCB board is first mounted with the IC, and then the chip is fixedly placed on the surface of the substrate, and then the electrical connection between the chip and the substrate is established by wire bonding, and after the test is qualified, the glue is sealed to become A full-color LED module. Traditional surface mount LED display has many processing techniques. In the process of reflow soldering, due to the different expansion coefficients of the SMD lamp bead bracket and epoxy resin under high temperature conditions, it is easy to cause the bracket and the epoxy resin encapsulation shell to fall off. The gap, the phenomenon of dead lights gradually appeared in the later use, resulting in a higher defect rate. The reason why the COB technology display screen is more stable is that there is no need to go through the reflow soldering and sticking of the lamp in the processing technology, which avoids the problem of the gap between the lamp bead bracket and the epoxy resin caused by high-temperature soldering in the welding machine. Therefore, COB products Dead lights are not easy to appear after leaving the factory. In addition, COB's unique packaging method also effectively protects the light-emitting diodes and enhances the resistance. Durability The COB process small-pitch LED display has the properties of anti-impact, waterproof, moisture-proof, dust-proof, oil-proof, anti-oxidation, anti-static, etc., so it has the characteristics of abrasion resistance and easy cleaning. The surface of the lamp point is convex into a spherical surface, smooth and hard, resistant to impact and abrasion; defective points can be repaired point by point; there is no mask, and dust can be cleaned with water or cloth. Energy saving The COB display screen uses large-chip light-emitting diodes, which can effectively improve the brightness, and the heat dissipation is uniform, the brightness attenuation coefficient is small, and it can maintain better consistency after long-term use. When the technicians use a 480*480mm cabinet and the brightness is 1000nit, the energy consumption of COB-P2.5 and SMD-P2.5 is compared. Among them, COB consumes 80.57W and SMD consumes 165.7W. It can be concluded that the same brightness is provided. Bottom, COB heat dissipation is smaller and more energy-saving. The significant advantages of COB packaging technology in terms of stability, light-emitting effect, durability, power consumption, etc., have established the technology and market position of COB packaging as a mainstream packaging technology. |
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