What are the performance of potting AB glue products? |
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| Reading Volume： 【 2683 】 | Time： 【 2017-12-13 】 | |
| The potting AB glue product is a heating curing type one-component epoxy resin encapsulating glue; 2. The potting AB glue needs to be heated to cure and needs to be stored at a low temperature; baking the epoxy resin 3. After the potting AB glue is cured It has strong toughness, high bonding strength, impact resistance, and vibration resistance; 4. The cured AB glue has good acid and alkali resistance, moisture and water resistance, oil and dust resistance, and resistance to humidity and heat and atmospheric aging; 5. The cured product of potting AB glue has good electrical and physical properties such as insulating glue, compressive resistance, and high bonding strength. The scope of application of potting AB glue: 1. It is recommended to use coil drip dipping, impregnation and fixing of motor coils to avoid coil loosening during high-speed operation; 2. It can also be used for bonding and fixing electronic components, crafts, and gifts , It has excellent bonding strength for packaging and bonding between metals, ceramics, glass, fiber products and hard plastics; Precautions for using potting AB glue 1. The rubber should be sealed and stored in a dry and room temperature environment. The mixed rubber should be used up as soon as possible to avoid waste. 2. This product is a non-dangerous product, but do not take it in the mouth or eyes. 3. This product is non-toxic, has good physiological inertia, and has no irritation or damage to the skin. The product does not contain flammable and explosive ingredients, will not cause fires and accidents, and has no special requirements for transportation. 4. After storage for a period of time, the glue will delaminate. Please use after stirring evenly without affecting performance. 5. The following substances may hinder the curing of this product, or the phenomenon of non-curing, so it is best to apply it after simple experimental verification, and clean the application part if necessary. a. Incompletely cured condensation type silica gel. b. (Amine) curing type epoxy resin. c. Solderflux. |
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