Advantages of thermal conductive potting glue in electronic potting glue |
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| Reading Volume： 【 2027 】 | Time： 【 2017-11-21 】 | |
| 1. Typical application 1. Suitable for effective thermal connection of many heat sinks that require effective cooling; 2. Suitable for high-voltage anti-corona, non-flammable coatings used in connection with high-voltage flyback transformers of TV sets and similar applications; 3. Suitable for filling gaps between heating elements and heat dissipation facilities in various electronic and electrical equipment to improve heat dissipation; 4. The contact surface between the power amplifier tube and the heat sink suitable for the electronics industry: such as TV, DVD, CPU and power amplifier tube, which act as a heat medium; 5. It is suitable for surface coating and overall potting of microwave devices such as microwave communication, microwave transmission equipment, special power supplies, and stabilized power supplies; 6. Suitable for heat transfer of electronic components, such as transistors, ballasts, thermal sensors, computer fans, etc., high-power transistors (plastic tube), heat transfer medium in the gap between diodes and substrates (aluminum, copper), Rectifier and electrical thermal insulation material. 2. Compared with general thermal grease: 1. Very low volatilization loss, no drying, no melting, good material adaptability and wide temperature range (-50 to 250°C); 2. Non-toxic, odorless, non-corrosive, stable chemical and physical properties, thermal conductivity: 0.80 to 5.0 W/(m·K); 3. Excellent thermal conductivity, electrical insulation and stability in use, high and low temperature resistance; 4. Water-resistant, non-curing, and non-corrosive to metal materials in contact (copper, aluminum, steel). |
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