Functional requirements of electronic potting glue

Reading Volume：【 2084 】

Time：【 2017-09-05 】

Electronic potting glue is a kind of mold glue poured on electronic components. It has fluidity. The viscosity of the glue varies according to the product's function, raw material, and production process.
1. Electronic potting glue needs satisfactory functional requirements
1. Strong resistance to cold and heat changes, even if you experience the cold and heat changes between -60℃～200℃, the colloid can still maintain elasticity without cracking;
2. It has excellent heat conduction ability, which can effectively improve the heat dissipation ability of electronic products after potting;
3. Electronic potting glue has no corrosive effect on electronic components;
4. Even if the cured colloid is processed by machinery, it will not deform;
5. With hydrophobic function, it can improve the moisture-proof function of electronic components after potting;
6. Electronic potting glue has excellent weather resistance and salt spray resistance to ensure that electronic components are not corroded by the natural environment;
7. The electrical insulation is strong, which can effectively improve the insulation between internal components and circuits after potting; 8. It can be cured at room temperature and can be cured by heating. The most powerful potting adhesive on the market is the electronic potting of organic silicon Sealant, such as Hongyejie's silicone electronic potting sealant, has the functions of heat conduction, flame retardant, high temperature resistance, and non-corrosion.
2. Comparison of mold glue, epoxy resin and polyurethane materials
1. Epoxy resin strengths:
(1) Thermal stability and anti-radiation ability, strong adhesion, and high light transmittance;
(2) Metal bonding strength is better; Disadvantages:
(1) Heat is released during curing, which will affect the functions of particularly sophisticated electronic products. Seriously, the electronic products will be burned out, and they will be corrosive and toxic, and the shrinkage rate will also be large.
(2) Epoxy resin will have aging problems under the influence of ultraviolet rays and temperature, and the repairability is not good.
2. Polyurethane (
1) In terms of temperature resistance: the working temperature can only reach about 150 degrees, higher temperatures will lose its function when aging, and the operating temperature of silica gel can reach 300 degrees;
(2) In terms of hardness: Polyurethane is harder than silicone but softer than epoxy
Three, the role of mold glue
Electronic potting glue is widely used in various electronic components. The mold glue can provide excellent heat dissipation and flame retardant functions, and it can also effectively improve the shock and moisture resistance of electronic components, fixed sealing, and ensure the stable operation of electronic components Sex and extended life span.

Page【1】

Previous： What is the difference betw

Next： How to apply the conformal

Other News

Jiadi New Material Selected as a Pilot Enterprise of Dongguan Doubling Program in 2023

Jiadi New Material was recognized as a national specialized, special and new

Epoxy adhesive in electronic components

The performance and application of acrylate structural adhesive

Factors affecting the performance of wet-curing polyurethane adhesives