Thermal conductive mud

Product Information:

Thermal conductive silica mud series

Product description

JD108 series a two-component room temperature or heat curing, with thermal conductivity, soft thermal conductive filler materials.

Main uses

Used in mobile phone, optical fiber and other communication equipment

Suitable for thermal conductive bonding of Printed Circuit Board and fragile components

application in other relevant places

Product Characteristics

Good fluidity, easy operation and rework

In line with Rohs, HF, REACH and other environmental requirements

Good weather resistance and good insulation

Technical Parameter