What are the LED chip packaging materials

Reading Volume：【 160 】

Time：【 2023-08-27 】

Silicone, i.e. organosilicon compounds, refers to compounds that contain Si-O bonds and at least one organic group is directly connected to the silicon atom. The key properties of silicone products include excellent temperature resistance, i.e., structural stability at high and low temperatures; good weathering resistance, i.e., not easily decomposed by ultraviolet rays and ozone in the atmospheric environment; and stable electrical insulation properties, i.e., low dielectric loss, high voltage resistance, and excellent surface resistance coefficient, etc. Epoxy resin refers to epoxy resins containing two or more epoxy groups in their molecules. Epoxy resin refers to organic polymer compounds containing two or more epoxy groups in the molecule, with high mechanical properties, strong cohesion, dense molecular structure, excellent adhesive properties, low curing shrinkage, low internal stress, insulation, corrosion resistance and heat resistance. The key performance of the above silicone and epoxy resin materials to meet the important performance needs of electronic components bonding, encapsulation, the reliability of the encapsulated electronic devices, service life, etc. has an important role, which has led to the wide application of silicone and epoxy resin materials in the field of electronic and electrical packaging and sustainable development.

LED chip packaging in addition to the need to meet the requirements of high precision chip packaging and device reliability, but also need to ensure the realization of optical properties, so the packaging process requirements are extremely stringent. As one of the core materials in the LED chip encapsulation process, on the basis of the basic functions of bonding, fixing, encapsulation, etc., it also needs to have refraction, light transmission, electrical conductivity, thermal conductivity, water vapor barrier, shock absorption and impact resistance, etc., and other types of composite functions, product performance and quality and stability of LED devices, modules and end products have an important impact on the luminous efficacy, reliability, and longevity, which determines the higher product value. Added value of the product.

The main products of electronic adhesives for LED chip encapsulation include high refractive index silicone encapsulation adhesive, Mini LED silicone encapsulation adhesive, silicone solid crystal adhesive, electronic epoxy encapsulation adhesive, LED epoxy molding compound, conductive silver adhesive, etc., which have been widely used in the fields of new type of displays, semiconductor general illumination, semiconductor special illumination, semiconductor device encapsulation, aerospace, etc. The main application is in the process of LED chip encapsulation. Mainly used in LED chip encapsulation process of encapsulation, solid crystal link. The series of products can be applied to different types of chips such as flip-chip, front-loading structure, vertical structure, etc. as well as various new LED chip packaging methods such as SMD, POB, COB and CSP, etc. The specific application scenarios of the products are as follows:

Main Performance Requirements The application performance system of electronic packaging materials is relatively complex, mainly including four categories: optical performance, reliability, process operability and stability. In the process of optimizing a specific performance, the reaction between polymer components in the formulation may adversely affect other performance indicators. Therefore, balancing and co-optimizing these properties has a high technical threshold.

With the continuous development of new display, semiconductor general lighting, semiconductor special lighting and other downstream applications, LED chip packaging process has evolved rapidly, forming a market pattern of coexistence of various packaging processes. Thin and light, micro-pitch, high luminous efficiency and other packaging technology development trends on the performance requirements of electronic packaging materials continue to improve.

At the same time, with the continuous enrichment of package forms, chip structures and substrate types, downstream customers are constantly updating their package process technology routes, which puts forward a higher demand for electronic packaging materials manufacturers to stock up on the richness of their products. The technical difficulty of electronic packaging materials lies in the need to transform the application requirements of downstream customers for electronic packaging materials from process and performance to product technical index requirements, and to adjust and balance the technical indexes through the design and independent synthesis of core components, optimization of formula development, and control of key processes.

Production process of silicone encapsulation materials

Organosilicon encapsulation materials are mainly of two-component type, and the core components include organosilicon resin, cross-linking agent, toughening agent, inhibitor, platinum catalyst and other auxiliaries, with component A mainly containing organosilicon resin, toughening agent and platinum catalyst, and component B mainly consisting of organosilicon resin, cross-linking agent and inhibitor.

The main production process consists of two stages: independent synthesis of silicone resins, cross-linking agents, toughening agents, silicone-based polymers and other additives, and glue compounding. In the stage of autonomous synthesis of silicone-based polymers, phenyl siloxane, hydrogenated silanes and terminating agents are used as raw materials, and semi-finished products of silicone-based polymers are formed through hydrolysis and condensation, dehydration, extraction and purification. Adhesive compounding process mainly involves mixing the silicone polymers according to specific formula and proportion, and then filtering and packaging to form component A and B finished products, which will be provided to customers for use.

Page【1】

Previous： The nature and use of 10 ki

Next： Industry Development Overvi