Condensation type electronic potting glue

Reading Volume：【 2716 】

Time：【 2018-12-23 】

1. Product features and applications
HY 215 is a low-viscosity two-component condensed silicone potting compound, which can be quickly cured at room temperature. It can be applied to the surface of PC (Poly-carbonate), PP, ABS, PVC and other materials and metal, with excellent bonding properties. Suitable for insulation, waterproofing and fixing of electronic accessories. Fully meet the requirements of the EU ROHS directive.
Two, typical use
-General electrical module potting protection
-LED display outdoor potting protection
3. Use process:
1. Before mixing, first stir the A component thoroughly, so that the sedimentation filler is fully mixed, and the B component is fully shaken.
2. When mixing, the weight ratio of component A: component B = 10:1 should be observed.
3. When HY 215 is used, it can be defoamed as required. The mixture of A and B can be stirred evenly and put into a vacuum container, degassing at 0.08MPa for 3 minutes, then it can be poured for use.
4. HY 215 is a room temperature curing product. After it is poured, it is cured at room temperature. After the basic curing, it enters the next process. It takes 24 hours to fully cure. Ambient temperature and humidity have a great influence on curing.
4. Technical parameters before and after curing:
Performance
A component
B component
Appearance before curing
Black viscous fluid
Colorless or slightly yellow transparent liquid
Viscosity (cps)
2500±500
Operational performance Part A: Part B (weight ratio) 10:1 Operational time (min) 20-30 Curing time (hr, basic curing) 3 Curing time (hr, fully cured) 24 Hardness (shore A) 15± 3 After curing
Thermal conductivity coefficient [W(m·K)]≥0.8 Dielectric strength (kV/mm) ≥25 Dielectric constant (1.2MHz) 3.0～3.3 Volume resistivity (Ω·cm) ≥1.0×1016 Flame retardancy 94-V1

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