Thermal conductive potting adhesive

Product Introduction:
This product is used for encapsulation protection of electronic components, module power supplies, circuit boards, and other products that require high temperature resistance and thermal conductivity.
Applied to electronic modules, LED waterproof power supplies, automotive HID light module power supplies, PCB boards, inverters, reactors, sensors, etc.
Product characteristics:
Low viscosity and good fluidity.
High physical and mechanical properties.
Resistance to cold and heat shock and high temperature aging
High thermal conductivity and excellent heat dissipation effect
-Stable physical and mechanical properties can be maintained for a long time at 50 ℃ to 200 ℃